Juanyun Thermal Management Hardware and Firmware Archive卷云科技热管理硬件与固件开发档案

Project Brief项目简述

This is the main Juanyun internship project page. The earlier separate ACUnit, BaseUnit, DHT11 / AM2302, and actuator / BLDC pages are folded into one hardware-and-firmware trail: board versions, firmware structure, sensor-board planning, actuator experiments, legacy files, and process notes sit together.

这页作为卷云科技实习经历的主项目页来写。外机控制平台、底座板 STM32 固件、DHT11 / AM2302 温湿度小板、螺线管阀门和 BLDC 静音风扇放在同一条线上看，更接近真实工作里的状态：一边画板，一边写固件，一边查传感器和驱动资料，还要不停把文件整理清楚。

What Can Be Shown哪些内容能放

The only local source folders treated as non-public are Current_Product_ACUnit_Project and Current_Product_BaseUnit_Project. The public page can show reviewed screenshots and high-level writing about those current-product directions, but it does not publish their raw Gerber archives, schematic PDFs, BOM / PnP files, EDA / CAD source, complete firmware source, internal requirements, manufacturing packages, vendor folders, installers, generated build outputs, invoices, billing records, or credentials.

卷云资料里只有 Current_Product_ACUnit_Project 和 Current_Product_BaseUnit_Project 两个目录按敏感资料处理。这里可以放已经脱敏的截图和概览叙述，但不放这两个目录下的生产包、原理图、BOM、PnP、完整源码、内部需求、制造资料、安装包、vendor、构建输出或财务凭据。其他非 Current_Product 的 legacy 材料经过筛选后放在页面下方的项目资料里。

Subproject 1: ACUnit Control Platform子项目一：外机控制平台

The ACUnit line is the largest and most product-facing part of the archive. It involved a control-board platform with main board, power distribution, interaction board, compressor / fan / electronic-expansion-valve interfaces, sensor inputs, and firmware-facing pin and module constraints. The public version shows the system block diagrams and board-render snapshots already reviewed for display.

外机控制平台是这组材料里最接近公司当前产品的一条线。这里保留的是系统层级：主控板、分电板、交互板、压缩机、风机、电子膨胀阀、传感器输入，以及固件侧需要面对的引脚、模块和接口约束。具体生产导出文件和完整源码不放公网，只放已经审核过的框图和板卡渲染截图。

• ACUnit V2.0 / V2.1 system-block screenshots are used as public-safe architecture evidence.
• Main, power, and UI board renders show board-version structure without exposing raw design files.
• Pressure-transmitter and PWM-fan parameter screenshots document the kind of interface constraints firmware had to respect.
• Related notes below preserve the hardware revision, board, and firmware reflections without turning private company packages into downloads.

Subproject 2: BaseUnit STM32 Firmware子项目二：底座板 STM32 固件

The BaseUnit firmware line is described through architecture and debugging notes instead of raw source release. Its scope covered periodic temperature / humidity sensing, local OLED display, fan control, Bluetooth reporting, outlet / presence style state detection, and Flash-backed parameter persistence. The useful part is how the firmware was separated into generated HAL code, board-support modules, service logic, and app-level behavior.

底座板 STM32 控制固件不作为源码发布，而是作为嵌入式系统结构来讲。它覆盖温湿度采集、本地 OLED 显示、风扇控制、蓝牙上报、状态检测和 Flash 参数保存。重点是 HAL 生成代码、BSP、服务模块和应用逻辑怎么分开，以及这种小设备为什么也要考虑掉电记忆和任务节拍。

• Sensing path: temperature / humidity sampling, state refresh, and update cadence.
• Interaction path: local display, user-visible state, and basic parameter feedback.
• Control path: fan PWM and state-dependent behavior.
• Persistence path: Flash-backed setting storage and restart continuity.

Subproject 3: DHT11 / AM2302 Breakout子项目三：温湿度传感器小板

The DHT11 / AM2302 task is small but complete enough to belong in the main project. It turns a 4-pin humidity / temperature sensor body into a practical 3-pin module interface with pull-up, decoupling, package, board-size, connector, and MCU validation constraints.

DHT11 / AM2302 小板任务规模不大，但非常适合放在大项目里：它把一个 4 引脚温湿度传感器整理成 3P 模块接口，同时明确上拉、去耦、封装、尺寸、连接器、上电等待和 MCU 验证要求。小任务如果只写“接了 DHT11”会很空；把这些约束写出来，才像一个完整的硬件任务。

• Target board outline: 30 mm x 14 mm.
• Interface: 3V3 / DATA / GND, single-wire-style data path.
• Support components: pull-up, decoupling, and optional signal damping.
• Mechanical note: one M2 positioning hole and a simple 2-layer PCB assumption.
• Public evidence: the planning PDF and cover image are listed below.

Subproject 4: Actuator, Display, And Fan Driver Archive子项目四：执行器、显示与风扇驱动归档

The smaller actuator material is no longer a standalone project page, but it is still useful inside the Juanyun record. It contains solenoid-valve STM32 source excerpts, an IOC file, OLED and EC11 encoder schematic references, a ULN2003 datasheet, and a BLDC quiet-fan BOM / EasyEDA file. These files show the actuator side of the internship material: driving loads, reading simple controls, showing state, and keeping board traces.

螺线管阀门和 BLDC 静音风扇不再单独作为项目页，但放在卷云大项目里仍然有价值。资料里有 STM32 阀门控制源码摘录、IOC 文件、OLED 和 EC11 编码器原理图参考、ULN2003 资料，以及 BLDC 静音风扇 BOM / EasyEDA 文件。它们对应的是执行器、显示输入和小型驱动板这条支线。

The newly added EEV board render and schematic make this branch easier to read. It is a small ULN2003A driver board, but the useful detail is direct: one side shows the connector and transistor-array layout, the other side shows how the LEDs and valve-side outputs are wired.

这次补进来的 EEV 小板图把执行器这一段变得清楚很多。板子不大，核心就是 ULN2003A、输入排针、阀侧连接器和几路指示灯；3D 渲染图看摆放，电路图看驱动路径，放在一起比只写“做过阀门驱动”更实在。

Subproject 5: DIY Pressure-Flow Cooling Prototype子项目五：DIY 压风式散热器原型

The DIY cooling prototype also belongs in this larger thermal-management trail. The earlier page already kept the 3D-printing route and desktop demo; the new STM32-version PCB render is better as a hardware-facing snapshot. It shows how the airflow prototype slowly picked up a real control board: USB-C, DC input, DCDC area, switches, headers, and an MCU footprint all started living on the same board.

DIY 压风式散热器也放回这条热管理硬件线里看。原来更多是在看 3D 打印外壳、桌面端 demo 和 ESP32 控制；这次补进来的 STM32 版 PCB 渲染更像硬件版本记录。USB-C、DC 输入、DCDC、按键、排针、主控封装这些东西一上板，这个原型就不只是“做了个风道”，而是开始长成一套小控制硬件。

Process Material: Hardware SOP流程材料：硬件开发 SOP

The self-authored hardware SOP is kept as process material. A hardware internship is not only a list of boards: requirements, version naming, schematic checks, PCB checks, fabrication outputs, bring-up notes, and review habits decide whether later work can still be understood.

自写硬件 SOP 放在这里，是因为硬件实习不只是“画了几块板”。需求、版本命名、原理图检查、PCB 检查、生产输出和调试记录如果当时不写，几个月后再看文件夹会非常痛苦。这份 SOP 更像当时整理工作习惯留下来的手册。

What This Page Still Needs后面还要补

The next useful layer is the debugging detail: why an interface was chosen, which version fixed which problem, what to check first on power-up, how sensor readings were chased when they looked wrong, and how firmware timing affected peripherals. The ACUnit board, BaseUnit firmware, sensor breakout, actuator material, fan work, and SOP are not isolated pieces. They keep returning to the same hardware-and-firmware questions: power, interfaces, timing, debugging, and records.

后面要继续补的是更细的调试说明：为什么这样选接口，哪个版本解决了什么问题，上电时先查哪里，传感器读数异常时怎么排，固件任务节拍怎么影响外设。外机板、底座板、传感器小板、执行器、风扇和 SOP 不是互相无关的小块，它们都在热管理硬件与固件开发里反复碰到同一类问题：电源、接口、时序、调试和记录。